config.mk

export DESIGN_NICKNAME = hsm
export DESIGN_NAME = HEPv3
export PLATFORM = ihp-sg13g2

export SRAM_NAME = RM_IHPSG13_1P_8192x32_c4_bm_bist

export VERILOG_FILES = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/src/HEPv3.v \
                       ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/src/PQVexRiscvVEHEP.v \
                       ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/src/AES_Masked.v

export SDC_FILE = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/constraint.sdc

export ADDITIONAL_LIBS = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/macros/$(SRAM_NAME)/lib/$(SRAM_NAME)_tc_1d20V_25C.lib
export ADDITIONAL_LEFS = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/macros/$(SRAM_NAME)/lef/$(SRAM_NAME).lef
export ADDITIONAL_GDS  = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/macros/$(SRAM_NAME)/gds/$(SRAM_NAME).gds

export SEAL_GDS = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/macros/sealring_4540x4540.gds

export FOOTPRINT_TCL = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/footprint.tcl
export PDN_TCL = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/pdn.tcl

export MACRO_PLACEMENT = ./designs/$(PLATFORM)/$(DESIGN_NICKNAME)/macro_placement.cfg

# Available area: 4540um x 4540um
# Sealring: roughly 60um
# I/O pads: 180um
# Bondpads: 70um
# Margin for core power ring: 80um
# Total margin to core area: 330um
export DIE_AREA  =   0   0 4420 4420
export CORE_AREA = 330 330 4090 4090

export USE_FILL = 1

# The masked AES needs a bit of synthesized memory
export SYNTH_MEMORY_MAX_BITS = 8192

# The SRAM cell GDS contains a bunch of empty instances
export GDS_ALLOW_EMPTY = RM_IHPSG13_1P_BITKIT_16x2_LE_con_edge_lr|RM_IHPSG13_1P_BITKIT_16x2_LE_con_tap_lr|RM_IHPSG13_1P_BITKIT_16x2_TAP_LR|RM_IHPSG13_1P_BITKIT_16x2_POWER_ramtap|RM_IHPSG13_1P_BITKIT_16x2_LE_con_corner|RM_IHPSG13_1P_BITKIT_16x2_CORNER|RM_IHPSG13_1P_BITKIT_16x2_TAP|RM_IHPSG13_1P_BITKIT_16x2_EDGE_TB